Kyeung Hwan Kim

Title: Kyeung Hwan Kim: Innovator in Semiconductor Packaging

Introduction

Kyeung Hwan Kim is a notable inventor based in Eumseong, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods.

Latest Patents

Kyeung Hwan Kim holds a patent for a semiconductor package that includes a redistribution structure. This structure features at least one redistribution insulating layer and at least one redistribution pattern. The semiconductor package also includes at least one semiconductor chip located on the redistribution structure, along with a molding layer that covers the semiconductor chip. The redistribution pattern consists of a redistribution via that passes through the redistribution insulating layer and extends in a first direction perpendicular to the top surface of the redistribution structure. Additionally, a redistribution line extends in a second direction parallel to the top surface. The design incorporates specific inclinations in the inner side walls of the redistribution via, and the thickness difference between the central portion and the edge of the redistribution line ranges from 1% to 10% of the central thickness.

Career Highlights

Kyeung Hwan Kim is currently employed at Nepes Co., Ltd., where he continues to develop innovative semiconductor solutions. His work has been instrumental in advancing the technology used in semiconductor packaging.

Collaborations

Kyeung Hwan Kim collaborates with Hyo Young Kim, contributing to the development of cutting-edge semiconductor technologies.

Conclusion

Kyeung Hwan Kim's contributions to semiconductor packaging highlight his innovative spirit and technical expertise. His patent reflects a significant advancement in the field, showcasing the importance of continuous innovation in technology.