Yongin-si, South Korea

Kyeong Bin Lim

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Yongin-si, KR (2021)
  • Gyeonggi-do, KR (2022)

Company Filing History:


Years Active: 2021-2025

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3 patents (USPTO):Explore Patents

Title: Innovations by Kyeong Bin Lim: Pioneering Semiconductor Technology

Introduction

Kyeong Bin Lim, a prominent inventor based in Yongin-si, South Korea, has made significant strides in the field of semiconductor technology. With a total of two patents to his name, Lim's work is a testament to his innovative thinking and engineering prowess.

Latest Patents

Lim's latest patents focus on advanced semiconductor devices and their manufacturing methods. One of his notable inventions involves a semiconductor device comprising a substrate, a via that penetrates the substrate, a via insulating film along the inner wall of the via, and a core plug that fills the via. Importantly, the residual stress of the via insulating film is engineered to be between 60 MPa and -100 MPa, enhancing the performance and reliability of the semiconductor device.

Career Highlights

Kyeong Bin Lim is currently affiliated with Samsung Electronics Co., Ltd., where his contributions have played a vital role in the company's advancements in semiconductor technologies. His innovative designs and methods have the potential to impact various applications within the electronics industry.

Collaborations

Lim has collaborated with talented professionals such as Hyo Ju Kim and Jeong Min Na, contributing to a dynamic and innovative work environment at Samsung. These collaborations bring together diverse expertise, fostering creativity and the development of state-of-the-art semiconductor technologies.

Conclusion

Kyeong Bin Lim's inventive spirit and technical expertise have positioned him as a key player in the semiconductor industry. With his recent patents paving the way for future advancements, Lim's work continues to inspire innovation within technology and engineering domains.

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