Samsung Electronics Co., Ltd.

Kyeong Bin Lim

Ho Chang Lee

Jeong Min Na

Sung Hyup Kim

Hyo Ju Kim

Byung Gook Kim

Jong Keun Oh

A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to −100 MPa.

Semiconductor device and a manufacturing method thereof

A support device for a substrate and a substrate cleaning apparatus, the support device including a support on which the substrate is loadable; a rotor that rotates the support; and an oscillator that oscillates the substrate in a direction perpendicular to a surface of the substrate, wherein the substrate oscillates according to a natural frequency of the substrate or a natural frequency of particles on the substrate.

Substrate support device and substrate cleaning device including the same

A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to &#x2212;100 MPa.

Growing community of inventors

Yongin-si, South Korea

Kyeong Bin Lim