The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
Feb. 01, 2019
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Kyeong Bin Lim, Yongin-si, KR;
Sung Hyup Kim, Hwaseong-si, KR;
Hyo Ju Kim, Seoul, KR;
Ho Chang Lee, Suwon-si, KR;
Jeong Min Na, Seoul, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/532 (2006.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/321 (2006.01); H01L 23/00 (2006.01); H01L 21/3105 (2006.01); H01L 23/522 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/02274 (2013.01); H01L 21/76819 (2013.01); H01L 21/76831 (2013.01); H01L 21/76841 (2013.01); H01L 21/76898 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); H01L 25/0657 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01); H01L 21/76877 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 23/53257 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/02372 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01);
Abstract
A semiconductor device including: a substrate; a via which penetrates the substrate; a via insulating film formed along an inner wall of the via; and a core plug which fills the via, wherein a residual stress of the via insulating film is 60 MPa to −100 MPa.