Kwon Shim

Title: Kwon Shim - Innovator in Semiconductor Packaging

Introduction

Kwon Shim is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance operational reliability.

Latest Patents

Kwon Shim holds a patent for a ball grid array semiconductor package that utilizes a metal carrier ring. This design features a semiconductor chip mounted on a printed circuit board (PCB) with a copper circuit pattern. The package includes bond wires that connect the chip to the circuit pattern, and a rectangular metal heat spreader that surrounds the chip. This configuration allows for efficient heat dissipation, improving the package's reliability. The molding compound used in the design protects the chip and wires from environmental factors while ensuring that certain portions of the heat spreader remain exposed. This innovative approach to semiconductor packaging has resulted in a patent count of 1 patent.

Career Highlights

Kwon Shim has worked with prominent companies in the semiconductor industry, including Anam Semiconductor Inc. and Amkor Technology, Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and packaging solutions.

Collaborations

Kwon Shim has collaborated with various professionals in his field, including his coworker Young Wook Heo. Their joint efforts have likely led to advancements in semiconductor packaging technologies.

Conclusion

Kwon Shim's contributions to semiconductor packaging through his innovative designs and collaborations highlight his importance in the field. His work continues to influence the industry, ensuring improved reliability and performance in semiconductor applications.