The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 1999
Filed:
Dec. 31, 1996
Kwon Shim, Seoul, KR;
Young Wook Heo, Kyungki-do, KR;
ANAM Semiconductor Inc., Seoul, KR;
AMKOR Technology, Inc., Chandler, AZ (US);
Abstract
A ball grid array semiconductor package includes a semiconductor chip mounted to the top side of a printed circuit board (PCB), having a copper circuit pattern at a position outside a chip mounting zone. A plurality of bond wires electrically connect the chip to the copper circuit pattern. A rectangular ring-shaped metal heat spreader is attached to the PCB surrounding the chip, with the outer periphery of the ring substantially coextensive with the outer periphery of the PCB. A molding compound is provided in a zone inside the heat spreader thus protecting the chip and wires from atmosphere, while the molding compound extends to a heat spreader portion, leaving other portions of the heat spreader exposed to atmosphere. A plurality of solder balls are included on the bottom side of the PCB and are used as signal input and output terminals of the package. The BGA package easily dissipates heat during the operation of the package, improving the operational reliability of the package. A plurality of grooves may be formed on the heat spreader, to improve the integrating force between the molding compound and the heat spreader and to protect the chip from moisture.