Company Filing History:
Years Active: 2021-2025
Title: Kwangmo Lim: Innovator in Panel Level Packaging Technology
Introduction
Kwangmo Lim is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of semiconductor packaging. With a total of three patents to his name, Lim's work focuses on advanced technologies that enhance the performance and efficiency of multi-die products.
Latest Patents
One of Lim's latest patents involves panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers. This patent describes a foundation layer and methods for forming a conductive via. The process begins with the formation of a die pad over a die. A seed layer is then deposited over both the die pad and the foundation layer. Following this, a first photoresist layer is applied over the seed layer, which is patterned to create a conductive line opening above the die pad. A conductive material is deposited into this opening to form a conductive line. Subsequently, a second photoresist layer is applied and patterned to create a via opening over the conductive line. The conductive material is deposited into this via opening to form the conductive via, ensuring that the material only deposits on exposed portions of the conductive line. After the removal of the first and second layers, portions of the exposed seed layer are recessed, ultimately exposing the top surface of the conductive via.
Career Highlights
Kwangmo Lim is currently employed at Intel Corporation, where he continues to innovate in the field of semiconductor technology. His work is instrumental in advancing the capabilities of multi-die products, which are essential for modern electronic devices.
Collaborations
Lim collaborates with talented coworkers such as Srinivas V Pietambaram and Sri Ranga Sai Boyapati, contributing to a dynamic team focused on cutting-edge technology.
Conclusion
Kwangmo Lim's contributions to panel level packaging technology exemplify his commitment to innovation in the semiconductor industry. His patents reflect a deep understanding of complex interconnect systems, paving the way for future advancements in electronic device performance.