Growing community of inventors

Chandler, AZ, United States of America

Kwangmo Lim

Average Co-Inventor Count = 6.00

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 3

Kwangmo LimSrinivas V Pietambaram (3 patents)Kwangmo LimKristof Darmawikarta (3 patents)Kwangmo LimRobert Alan May (3 patents)Kwangmo LimSri Ranga Sai Boyapati (3 patents)Kwangmo LimJavier Soto Gonzalez (3 patents)Kwangmo LimKwangmo Lim (3 patents)Srinivas V PietambaramSrinivas V Pietambaram (130 patents)Kristof DarmawikartaKristof Darmawikarta (102 patents)Robert Alan MayRobert Alan May (86 patents)Sri Ranga Sai BoyapatiSri Ranga Sai Boyapati (63 patents)Javier Soto GonzalezJavier Soto Gonzalez (37 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Intel Corporation (3 from 54,781 patents)


3 patents:

1. 12218071 - Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers

2. 11735531 - Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers

3. 11101222 - Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers

Please report any incorrect information to support@idiyas.com
idiyas.com
as of
1/2/2026
Loading…