Kuo-Wei Tseng

Title: Kuo-Wei Tseng: Innovator in Chip Packaging Technology

Introduction

Kuo-Wei Tseng is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of chip packaging technology, holding a total of five patents. His innovative work has advanced the efficiency and effectiveness of chip designs, making him a notable figure in the industry.

Latest Patents

Among his latest patents is a chip packaging structure and related inner lead bonding method. This invention features a chip formed with a gold bump and a film substrate that includes an inner lead. The gold bump is designed with a first bonding surface and multiple side walls, ensuring electrical connectivity through a eutectic material coverage layer. Another significant patent is the test pad structure of a chip, which comprises various internal and extended test pads. This design enhances the contact area for probes, facilitating better signal and power transmission for testing purposes.

Career Highlights

Kuo-Wei Tseng is currently employed at Sitronix Technology Corporation, where he continues to innovate in chip technology. His work has not only contributed to the company's success but has also influenced the broader field of semiconductor technology.

Collaborations

He collaborates with talented coworkers, including Po-Chi Chen and Ying-Chen Chang, who contribute to the innovative environment at Sitronix Technology Corporation.

Conclusion

Kuo-Wei Tseng's contributions to chip packaging technology exemplify the impact of innovation in the semiconductor industry. His patents reflect a commitment to advancing technology and improving the functionality of electronic devices.