The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Jun. 30, 2020
Applicant:
Sitronix Technology Corp., Hsinchu County, TW;
Inventors:
Ying-Chen Chang, Hsinchu County, TW;
Po-Chi Chen, Hsinchu County, TW;
Kuo-Wei Tseng, Hsinchu County, TW;
Assignee:
Sitronix Technology Corp., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/4985 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05567 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13013 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16013 (2013.01); H01L 2224/16014 (2013.01); H01L 2224/16113 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/16502 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81097 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81345 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81805 (2013.01);
Abstract
A chip packaging structure includes a chip and a film substrate. The chip is formed with a gold bump, and the film substrate is formed with an inner lead, wherein the gold bump includes a first bonding surface and a plurality of side walls. The gold bump is electrically connected to the inner lead through a eutectic material coverage layer, and the first bonding surface and at least one of the plurality of side walls are covered by the eutectic material coverage layer.