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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11217508 B1

PDFFull Text
Date of Patent:
Jan. 04, 2022

Filed:

Oct. 16, 2018

Lead structure of circuit with increased gaps between adjacent leads

Applicant:

Sitronix Technology Corp, Jhubei, TW;

Inventors:

Kuo-Wei Tseng, Jhubei, TW;

Po-Chi Chen, Jhubei, TW;

Jui-Hsuan Cheng, Jhubei, TW;

Assignee:

Sitronix Technology Corp., Jhubei, TW;

Attorney:

Rosenberg, Klein & Lee

Primary Examiner:

Kyoung Lee

Assistant Examiner:

Christina A Sylvia

Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/60 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4952 (2013.01); H01L 23/4985 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49582 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 23/60 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/1416 (2013.01); H01L 2224/14154 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1716 (2013.01); H01L 2224/17154 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/8146 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81439 (2013.01); H01L 2224/81444 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/381 (2013.01);
Abstract

The present invention discloses a lead structure of the circuit, which comprises a first lead and a second lead. The first lead includes a first bump connecting part and a first lead segment. The first lead segment is connected to the first bump connecting part. The width of the first lead segment is smaller than the width of the first bump connecting part. The second lead is adjacent to the first lead and there is a lead gap therebetween. The second lead also includes a second bump connecting part and a first lead segment. The first lead segment of the second lead is connected to the second bump connecting part. The second bump connecting part and the first bump connecting part are arranged staggeredly. The second bump connecting part is adjacent to the first lead segment of the first lead.

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