This inventor holds 1 USPTO granted patent. Top assignee: Advanced Semiconductor Engineering, Inc.. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Kuo-Hua Chang: Innovator in Semiconductor Technology
Introduction
Kuo-Hua Chang is a notable inventor based in Zhongli, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods for forming metal bumps.
Latest Patents
Kuo-Hua Chang holds a patent for a "Method for forming metal bumps." This patent outlines a detailed process that includes supplying a substrate with multiple pads, forming a photoresist layer, and electroplating a metal layer. The method is designed to enhance the efficiency and effectiveness of semiconductor manufacturing.
Career Highlights
Kuo-Hua Chang is currently employed at Advanced Semiconductor Engineering, Inc., where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the methods used in the industry.
Collaborations
Kuo-Hua Chang has collaborated with notable colleagues such as Sheng-Ming Wang and Shuo-Hsun Chang. These collaborations have contributed to the development of innovative solutions in semiconductor technology.
Conclusion
Kuo-Hua Chang's contributions to the field of semiconductor technology through his patent and work at Advanced Semiconductor Engineering, Inc. highlight his role as a key innovator in the industry. His methods for forming metal bumps represent a significant advancement in semiconductor manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile