The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2009
Filed:
Dec. 08, 2006
Sheng-ming Wang, Taoyuan, TW;
Shuo-hsun Chang, Zhongli, TW;
Kuo-hua Chang, Zhongli, TW;
Chi-chih Huang, Taipei, TW;
Chih-cheng Chen, Taoyuan County, TW;
Sheng-Ming Wang, Taoyuan, TW;
Shuo-Hsun Chang, Zhongli, TW;
Kuo-Hua Chang, Zhongli, TW;
Chi-Chih Huang, Taipei, TW;
Chih-Cheng Chen, Taoyuan County, TW;
Advanced Semiconductor Engineering Inc., Kaohsiung, TW;
Abstract
A method for forming metal bumps is disclosed. Steps of the method include supplying a substrate containing a plurality of pads; forming a first photoresist layer on the substrate, herein the first photoresist layer covers the pads; performing a planarization step to remove a portion of the first photoresist layer so as to expose the pads; forming a conductive layer on the first photoresist layer and the pads; electroplating a metal layer on the conductive layer; forming a patterned second photoresist layer on the metal layer; a portion of the metal layer and the conductive layer which are not covered by the patterned second photoresist layer is removed by using the patterned second photoresist layer as a mask; removing the patterned second photoresist layer; and forming a solder mask on the substrate, wherein the solder mask has a plurality of openings to expose the metal layer located on the pads.