Taoyuan, Taiwan

Kuo-Fu Su

This inventor holds 48 USPTO granted patents and 18 published patent applications and 1 EPO patent, primarily in Flexible Circuit Boards. Top assignee: Advanced Flexible Circuits Co., Ltd.. Active years: 2007-2021.

USPTO Granted Patents = 48 

% Patents Active = 97.9

 

Average Co-Inventor Count = 2.6

ph-index = 6

Forward Citations = 328(Granted Patents)


Location History:

  • Taoyuan, TW (2007 - 2011)
  • Taoyuan Country, TW (2016)
  • Taoyuan County, TW (2012 - 2018)
  • Zhongli, TW (2011 - 2021)

Company Filing History:


Years Active: 2007-2021

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Areas of Expertise:
Flexible Circuit Board
Attenuation Reduction
Waterproof Structure
Conductive Adhesive
Microvia Structure
Signal Transmission
Connection Pads
Electrical Impedance
Bundled Cable
Differential Mode
Manufacturing Method
Grounding Structure
48 patents (USPTO):Explore Patents

Title: Innovations by Kuo-Fu Su: A Leader in Circuit Board Technology

Introduction

Kuo-Fu Su, based in Taoyuan County, Taiwan, is an acclaimed inventor with a remarkable portfolio of 48 patents. His innovations in circuit board technology have significantly impacted the field, making him a distinguished figure in the electronics industry.

Latest Patents

Among his latest contributions are two notable patents. The first is a "Circuit board structure incorporated with resin-based conductive adhesive layer," which discloses a circuit board structure that integrates a resin-based conductive adhesive layer. This innovative design features a conductive layer placed between a first and second circuit board, incorporating a first conductive paste layer and a resin-based conductive adhesive layer containing conductive particles. These particles facilitate electrical connections, enhancing the performance and reliability of electronic devices.

The second patent, a "stacked flexible printed circuit board assembly with side connection section," presents a novel assembly comprising two flexible printed circuit boards joined by a curved connection section. This design allows for an efficient arrangement where the first board is stacked on the second, ensuring that contact pads align perfectly for effective electrical connections. A height adjustment or adhesive layer is included to cater to plugging or soldering thickness requirements.

Career Highlights

Kuo-Fu Su has made significant strides during his tenure at Advanced Flexible Circuits Co., Ltd., where he continues to drive innovation in flexible circuit technology. His extensive understanding of circuit structures positions him as a key player in developing advanced electronic components.

Collaborations

Su often collaborates with talented professionals in his field, including notable coworkers like Gwun-Jin Lin and Chih-Heng Chuo. Together, they contribute to the growth and development of innovative solutions in flexible circuits, further enhancing the capabilities of their company.

Conclusion

Kuo-Fu Su’s extensive array of patents and his significant contributions to circuit board technology highlight his role as an innovator in the electronics industry. His work not only shapes the future of flexible circuits but also establishes a foundation for ongoing advancements in electronic design. With continued collaboration and ingenuity, his impact in the field is likely to expand further in the years to come.

Profile summary based on public USPTO records.
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