The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 26, 2017

Filed:

Aug. 18, 2016
Applicant:

Advanced Flexible Circuits Co., Ltd., Taoyuan County, TW;

Inventors:

Kuo-Fu Su, Taoyuan County, TW;

Gwun-Jin Lin, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/18 (2006.01); H05K 3/42 (2006.01); H05K 3/02 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H05K 1/0281 (2013.01); H05K 1/0298 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/025 (2013.01); H05K 3/064 (2013.01); H05K 3/188 (2013.01); H05K 3/429 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0352 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/0152 (2013.01);
Abstract

Disclosed is a structure of a flexible circuit board combined with a carrier board. The carrier board includes a thick copper layer, a thin copper layer, and a release layer formed between the thick copper layer and the thin copper layer. The flexible circuit substrate and the carrier board are bonded together by an adhesive layer. In a subsequent process, the release layer, together with the thick copper layer, is peeled from a top surface of the thin copper layer and the thin copper layer is preserved by being bonded by the adhesive layer to the flexible circuit substrate.


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