The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2017

Filed:

Mar. 04, 2015
Applicant:

Advanced Flexible Circuits Co., Ltd., Taoyuan County, TW;

Inventors:

Chih-Heng Chuo, Taoyuan County, TW;

Gwun-Jin Lin, Taoyuan County, TW;

Kuo-Fu Su, Taoyuan County, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/38 (2006.01); H01P 1/22 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01P 1/227 (2013.01); H03H 7/38 (2013.01); H05K 1/0225 (2013.01); H05K 1/0251 (2013.01); H05K 1/116 (2013.01); H05K 1/189 (2013.01); H05K 3/3447 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/093 (2013.01); H05K 2201/0939 (2013.01); H05K 2201/09381 (2013.01); H05K 2201/09718 (2013.01); H05K 2201/10931 (2013.01);
Abstract

Disclosed is an attenuation reduction structure for high-frequency connection pads of a circuit board with an insertion component. The circuit board includes at least one pair of differential mode signal lines formed thereon. A substrate has upper and lower surfaces respectively provided with at least one pair of upper connection pads and lower connection pads. A first metal layer is formed on the lower surface of the substrate. The first metal layer includes an attenuation reduction grounding pattern structure. The attenuation reduction grounding pattern structure includes a hollow area and at least one protruded portion. The protruded portion extends from the first metal layer in a direction toward the lower connection pads.


Find Patent Forward Citations

Loading…