Kuo-Chuan Liu

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuo-Chuan Liu. Retrieved from https://idiyas.com/inventor/kuo-chuan-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 22

% Patents Active = 86.4

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 146(Granted Patents)

Company Filing History:

22 out of 42,965

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2014-2023

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Areas of Expertise:

Semiconductor Device

Warpage Control

Testing Holders

Chip Unit

Die Package

Package Structure

3D Packages

Through Molding Via

Encapsulated Package

Package-on-Package

Method of Forming

22 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11764169 - Semiconductor device package with warpage control structure (2023-09-19),

2. 11579190 - Testing holders for chip unit and die package (2023-02-14),

3. 11340291 - Testing holders for chip unit and die package (2022-05-24),

4. 11329006 - Semiconductor device package with warpage control structure (2022-05-10),

5. 10698026 - Testing holders for chip unit and die package (2020-06-30),

6. 10685920 - Semiconductor device package with warpage control structure (2020-06-16),

7. 10163862 - Package structure and method for forming same (2018-12-25),

8. 10067181 - Testing holders for chip unit and die package (2018-09-04),

9. 10008480 - Package-on-package structure with through molding via (2018-06-26),

10. 9831190 - Semiconductor device package with warpage control structure (2017-11-28),

11. 9780076 - Package-on-package structure with through molding via (2017-10-03),

12. 9664707 - Testing holders for chip unit and die package (2017-05-30),

13. 9543284 - 3D packages and methods for forming the same (2017-01-10),

14. 9520385 - Package structure and method for forming same (2016-12-13),

15. 9502387 - Package-on-package structure with through molding via (2016-11-22),

Title: The Innovative Journey of Inventor Kuo-Chuan Liu

Introduction: Kuo-Chuan Liu, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Kuo-Chuan Liu holds several patents in the areas of semiconductor technology, renewable energy, and telecommunications, showcasing his versatility and ingenuity in various domains.

Career Highlights: With a career spanning over two decades, Kuo-Chuan Liu has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout his career, Kuo-Chuan Liu has collaborated with top engineers, scientists, and researchers, fostering a culture of innovation and knowledge sharing that has led to the creation of impactful technologies.

Conclusion: Inventor Kuo-Chuan Liu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a visionary in the world of inventions, inspiring the next generation of inventors to dream big and create a better future.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]