The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2016
Filed:
Jun. 29, 2015
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Hsien-Wei Chen, Hsin-Chu, TW;
Kuo-Chuan Liu, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/105 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/5384 (2013.01); H01L 25/50 (2013.01); H01L 2225/1058 (2013.01); H01L 2225/1088 (2013.01);
Abstract
A device comprises a bottom package comprising an interconnect structure, a molding compound layer over the interconnect structure, a semiconductor die in the molding compound layer and a solder layer embedded in the molding compound layer, wherein a top surface of the solder layer is lower than a top surface of the molding compound layer and a top package bonded on the bottom package through a joint structure formed by the solder layer and a bump of the top package.