Campbell, CA, United States of America

Kunlun Bai

USPTO Granted Patents = 2 

Average Co-Inventor Count = 8.0

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Kunlun Bai: Innovator in Semiconductor Lithography

Introduction

Kunlun Bai is a prominent inventor based in Campbell, California, recognized for his significant contributions to the field of semiconductor technology. With a total of two patents to his name, Bai has made notable advancements in the prediction and measurement of photoresist thickness defects. His groundbreaking work harnesses the power of machine learning, further solidifying his position as an influential figure in the industry.

Latest Patents

Bai's latest inventions include two innovative patents that address critical challenges in semiconductor device fabrication. The first patent, titled "Prediction and Metrology of Stochastic Photoresist Thickness Defects," focuses on utilizing a mask pattern for semiconductor devices to create a probability distribution of photoresist thickness, employing a machine learning module. This invention can effectively generate a probability map of Z-height, aiding in understanding the stochastic variations in photoresist thickness.

The second patent, "Lithography Mask Repair by Simulation of Photoresist Thickness Evolution," introduces a simulation-based model to repair mask designs by predicting layer thickness after manufacturing steps. This model not only evaluates the design more rapidly than conventional methods but also provides sensitivity metrics that inform how variations in the input mask design affect the output fabrication parameters.

Career Highlights

Currently, Kunlun Bai is employed at Kla Corporation, where he continues to push the envelope in semiconductor masking technology. His work has significantly influenced the methodologies surrounding lithography and mask design, making complex processes more efficient and reliable.

Collaborations

Throughout his career, Bai has collaborated with esteemed colleagues, including Guy Parsey and Xiaohan Li. These partnerships have fostered an environment of innovation and knowledge-sharing that enhances the development of cutting-edge technologies within their field.

Conclusion

Kunlun Bai's contributions to the semiconductor industry through his innovative patents reflect his dedication and expertise as an inventor. His approach, which integrates machine learning into traditional fabrication processes, positions him at the forefront of technological advancements. As his work continues to evolve, it is clear that Bai's impact on the sector will be felt for years to come.

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