Company Filing History:
2 out of 306 
2 out of 78 
Years Active: 2016
Title: Kunihiko Chihara: Innovator in Radiator-Integrated Substrates
Introduction
Kunihiko Chihara is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of manufacturing methods for integrated substrates, particularly in the area of radiator technology. With a total of 2 patents, his work showcases innovative approaches to enhancing the efficiency and functionality of electronic components.
Latest Patents
Chihara's latest patents include a manufacturing method of radiator-integrated substrates and a liquid-cooled integrated substrate. The first patent describes a process where a metal circuit board and a metal base plate are bonded to a ceramic substrate, forming a metal-ceramic bonded substrate. This substrate is then integrated with a radiator through a precise heat-bonding process that involves specific curvature radii and pressure conditions. The second patent focuses on a liquid-cooled integrated substrate, where an aluminum or aluminum alloy metal circuit board is bonded to a ceramic substrate, along with a liquid-cooling type radiator. This design emphasizes the relationship between the thickness of the metal circuit board and the metal base plate, ensuring optimal performance.
Career Highlights
Throughout his career, Kunihiko Chihara has worked with prominent companies such as Nippon Light Metal Company, Ltd. and Dowa Metaltech Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in substrate technology.
Collaborations
Chihara has collaborated with notable colleagues, including Hisashi Hori and Takanori Kokubo. These partnerships have fostered a creative environment that has led to innovative solutions in the field of integrated substrates.
Conclusion
Kunihiko Chihara's contributions to radiator-integrated substrates and liquid-cooled technologies highlight his role as a key innovator in the industry. His patents reflect a commitment to advancing manufacturing methods that enhance electronic component efficiency.