The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Mar. 13, 2013
Nippon Light Metal Company, Ltd., Tokyo, JP;
Dowa Metaltech Co., Ltd., Tokyo, JP;
Hisashi Hori, Shizuoka, JP;
Takanori Kokubo, Shizuoka, JP;
Hideyo Osanai, Tokyo, JP;
Kunihiko Chihara, Tokyo, JP;
NIPPON LIGHT METAL COMPANY, LTD., Tokyo, JP;
DOW A METALTECH CO., LTD., Tokyo, JP;
Abstract
A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500≦R≦surface pressure (N/mm)×2000+12000.