The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Jan. 12, 2011
Hisashi Hori, Shizuoka, JP;
Takanori Kokubo, Shizuoka, JP;
Hideyo Osanai, Tokyo, JP;
Takayuki Takahashi, Tokyo, JP;
Kunihiko Chihara, Tokyo, JP;
Hisashi Hori, Shizuoka, JP;
Takanori Kokubo, Shizuoka, JP;
Hideyo Osanai, Tokyo, JP;
Takayuki Takahashi, Tokyo, JP;
Kunihiko Chihara, Tokyo, JP;
Dowa Metaltech Co., Ltd., Tokyo, JP;
Nippon Light Metal Company, Ltd., Tokyo, JP;
Abstract
There is provided a liquid-cooled integrated substratein which a metal circuit boardmade of aluminum or an aluminum alloy is bonded to one surface of a ceramic substrate, one surface of a plate-like metal base platemade of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate, and a liquid-cooling type radiatorcomposed of a porous pipe composed of an extrusion material is bonded to another flat surface of the metal base plateby brazing, wherein a relation between a thickness tof the metal circuit boardand a thickness tof the metal base platesatisfies t/t≧2 where the thickness tof the metal circuit boardis 0.4 to 3 mm and the thickness tof the metal base plateis 0.8 to 6 mm.