This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2012.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2012
Title: Kunal Shah - Innovator in Microelectronic Technology
Introduction
Kunal Shah, an accomplished inventor based in Hillsboro, Oregon, has significantly contributed to the field of microelectronics. With a keen understanding of material science, Shah has secured a patent that enhances the performance and reliability of microelectronic devices.
Latest Patents
Shah's notable patent is titled "Polymer interlayer dielectric and passivation materials for a microelectronic device." This invention involves innovative polymeric dielectric layers that are critical for microelectronic applications. The patent describes an apparatus that includes interconnect structures of a microelectronic device, accompanied by polymeric dielectric layers exhibiting copolymer backbones comprised of two distinct monomeric units. This formulation enables improved performance and durability of microelectronic systems through enhanced structural integrity via cross-linking.
Career Highlights
Kunal Shah is currently employed at Intel Corporation, where he spends his time pioneering research in the microelectronics sector. His work focuses on developing advanced materials that drive innovation in semiconductor technology. Shah's contributions are vital to the ever-evolving landscape of microelectronics, reflecting his expertise and dedication to the field.
Collaborations
Throughout his career, Kunal has collaborated with esteemed colleagues, including Michael G. Haverty and Sadasivan Shankar. These partnerships illustrate the collaborative spirit prevalent in research and development environments, fostering innovative ideas and leading to groundbreaking advancements in technology.
Conclusion
Kunal Shah is a significant figure in the realm of microelectronics, with his patent on polymer interlayer dielectric materials marking a pivotal achievement. His role at Intel Corporation and teamwork with other talented professionals underscore the importance of collaboration in driving innovation. As technology continues to advance, Shah’s contributions will undoubtedly play a crucial role in shaping the future of microelectronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
