Kun-Shu Yang

Title: Innovations of Kun-Shu Yang in Polishing Technology

Introduction

Kun-Shu Yang is a notable inventor based in Aurora, IL (US). He has made significant contributions to the field of polishing technology, particularly in the development of advanced polishing pads. With a total of 2 patents to his name, Yang's work has had a considerable impact on the industry.

Latest Patents

Yang's latest patents include innovative designs for polishing pads. The first patent, titled "Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith," introduces a polishing pad that features a unique arrangement of grooves. This design allows for effective chemically-mechanical polishing of substrates by utilizing concentric grooves with different centers of concentricity. The second patent, "CMP polishing pad having edge exclusion region of offset concentric groove pattern," further enhances the polishing process by incorporating an exclusion region devoid of grooves, strategically placed around the circumference of the pad.

Career Highlights

Kun-Shu Yang is currently employed at Cabot Microelectronics Corporation, where he continues to innovate in the field of polishing technology. His work has been instrumental in advancing the capabilities of polishing pads used in various applications.

Collaborations

Yang has collaborated with notable colleagues, including Ching-Ming Tsai and Shi-Wei Cheng, to further enhance the development of polishing technologies.

Conclusion

Kun-Shu Yang's contributions to polishing technology through his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the industry and improve the efficiency of polishing processes.