Location History:
- Hsinchu, TW (1997)
- Chu-Nan, TW (1994 - 2000)
- Chu-Nan Town, TW (2001)
Company Filing History:
Years Active: 1994-2001
Title: **The Innovative Contributions of Kun-Luh Chen**
Introduction
Kun-Luh Chen, an accomplished inventor based in Chu-Nan, Taiwan, has made significant advancements in the field of integrated circuit packaging. With a remarkable record of seven patents to his name, Chen’s innovative approaches have streamlined manufacturing processes and enhanced product functionality in the semiconductor industry.
Latest Patents
Among his notable contributions, two of Chen's latest patents stand out. The first is an "Integrated circuit package architecture with a variable dispensed compound and method of manufacturing the same." This invention introduces a novel packaging method where a molded compound covers a leadframe while leaving a window for chip mounting. After the chip is installed and wire bonded, a dispensable material is introduced to enclose the chip. This material can be selected based on the application, allowing for transparent or colored options to meet various needs. This cost-effective method utilizes existing manufacturing equipment, making it scalable and efficient.
The second noteworthy patent is the "Architecture for dual-chip integrated circuit package and method of manufacturing the same." This design permits the simultaneous mounting of two chips on a single leadframe, which can either be identical or different types, such as memory and logic control chips. This architecture not only simplifies the manufacturing process but also improves yield rates, all achievable with current packaging technologies.
Career Highlights
Kun-Luh Chen has gained invaluable experience through his tenure at prominent companies like United Microelectronics Corporation and Amic Technology Corporation. His background in these leading firms has equipped him with the insight necessary to push the boundaries of innovation in integrated circuit technology.
Collaborations
Throughout his career, Chen has collaborated with talented professionals, including his coworker Heng-Sheng Huang. Such partnerships have facilitated the exchange of ideas and fostered an environment conducive to groundbreaking inventions.
Conclusion
In summary, Kun-Luh Chen's inventive spirit and technical expertise have led to significant advancements in integrated circuit packaging. His latest patents not only demonstrate his commitment to innovation but also highlight the practicality and scalability of his approaches within the semiconductor industry. As technology continues to evolve, the contributions of inventors like Chen play a pivotal role in shaping the future of electronic components.