The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2001
Filed:
Mar. 25, 1998
AMIC Technology, Inc., Hsinchu, TW;
Abstract
An IC package architecture and a method of manufacturing the same are provided. By this packaging method, a molded compound is first formed, which covers the entire packaging area of the leadframe but leaving a window to expose the area where the chip is to be mounted. After the chip is mounted and wire bonded, a dispensed compound is formed the window to enclose the chip therein. The dispensing material can be variably selected by the manufacturer in accordance with actual application requirements. For instance, the dispensing material can be either a transparent material to allow the enclosed chip to be transparent to the outside, or a colored material for some prespecified identification purpose of the IC package. Moreover, the packaging method can be utilized on current types of IC packages and can be realized by using existing equipment and processes in a cost-effective manner without having to invest on new additional ones.