Jacob Jeng

Title: Innovation in Integrated Circuit Packaging: The Journey of Jacob Jeng

Introduction

Jacob Jeng, an innovative inventor based in Hsinchu, Taiwan, has made significant contributions to the field of integrated circuit (IC) packaging. With two patents to his name, he has developed groundbreaking methods that enhance the efficiency and versatility of IC manufacturing.

Latest Patents

Jacob Jeng's latest patents showcase his commitment to advancing IC technology. The first patent introduces an integrated circuit package architecture with a variable dispensed compound. This innovative packaging method begins by forming a molded compound that covers the entire packaging area of the leadframe while leaving a window for chip mounting. After the chip is mounted and wire bonded, a dispensed compound is applied to enclose the chip, with the flexibility for manufacturers to select dispensing material based on specific application needs. This may include transparent materials for visibility or colored compounds for identification purposes. Notably, this method is adaptable to current IC packages without necessitating significant investment in new equipment.

The second patent focuses on an architecture for dual-chip integrated circuit packages. This design allows two chips to be mounted on a single leadframe, accommodating both identical and different types of semiconductor devices. By simplifying the manufacturing process, this architecture increases the yield rate for the encapsulated IC chips. Like his first patent, this dual-chip package can also be produced using existing machinery, making it a cost-effective solution for manufacturers.

Career Highlights

Jacob currently works at Amic Technology Corporation, a company recognized for its leadership in IC packaging technology. His patents not only reflect his skill and ingenuity but also contribute to the company's mission to produce high-quality and efficient electronic components.

Collaborations

Throughout his career, Jacob has collaborated with esteemed colleagues such as Kun-Luh Chen and Edward Chen. These partnerships foster a creative environment that enhances innovation within their projects, leading to the successful development of novel packaging solutions.

Conclusion

Jacob Jeng's dedication to innovation in integrated circuit packaging exemplifies the pivotal role that inventors play in technological advancement. His patents not only provide tools for improved manufacturing processes but also push the boundaries of what is possible in the semiconductor industry. With a focus on efficiency and adaptability, Jacob's work continues to inspire future innovations in IC packaging.