The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Mar. 26, 1998
Amic Technology Inc., Hsinchu, TW;
Abstract
An architecture for a dual-chip IC package and a method of manufacturing the same are provided. The dual-chip IC package allows two chips to be mounted on the same leadframe in the same package. The two chips can be either the same type of a semiconductor device or two different types of semiconductor devices with different functions such as a memory chip and a logic control chip. The architecture allows a simplified manufacturing process and an increased good yield rate for the two IC chips that are to be enclosed in the dual-chip IC package. Moreover, the dual-chip IC package can be manufactured with existing packaging equipment and processes, so that it can be realized without having to invest on and install additional ones.