Kun-Chi Hsu

Title: Kun-Chi Hsu: Innovator in Semiconductor Packaging

Introduction

Kun-Chi Hsu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative designs and methods have advanced the efficiency and cost-effectiveness of semiconductor manufacturing.

Latest Patents

One of Kun-Chi Hsu's latest patents is a semiconductor packaging structure with a back-deposited shielding layer. This invention provides a method for batch semiconductor packaging structures that includes a grid with multiple frames glued onto an adhesive substrate. Multiple semiconductor devices align with corresponding frames and are adhered to the substrate. A metal layer then covers the semiconductor devices and the grid, effectively reducing metal scrap during the manufacturing process. This design allows for the adhesive substrate to be reusable, thus decreasing manufacturing costs.

Another notable patent is the chip carrier device, which features a frame, a chip support, and a limiter. The chip support is designed with a supporting film for chips to adhere to, with through holes for enhanced functionality. The limiter ensures that the chips are arranged correctly, providing a reliable structure for semiconductor applications.

Career Highlights

Kun-Chi Hsu is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging technology. His work has been instrumental in developing innovative solutions that enhance the performance and reliability of semiconductor devices.

Collaborations

Throughout his career, Kun-Chi Hsu has collaborated with notable colleagues, including Chin-Ta Wu and Shih-Chun Chen. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Kun-Chi Hsu's contributions to semiconductor packaging have established him as a key figure in the field. His innovative patents and collaborative efforts continue to shape the future of semiconductor technology.