The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2019
Filed:
May. 25, 2018
Applicant:
Powertech Technology Inc., Hsinchu County, TW;
Inventors:
Chui-Liang Chiu, Hsinchu County, TW;
Kun-Chi Hsu, Hsinchu County, TW;
Jen-Tung Tseng, Hsinchu County, TW;
Chin-Ta Wu, Hsinchu County, TW;
Assignee:
POWERTECH TECHNOLOGY INC., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/304 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3043 (2013.01); H01L 21/67092 (2013.01); H01L 21/6836 (2013.01); H01L 21/68735 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A wafer processing method uses a chuck table with smaller diameter than a semiconductor wafer to be processed. A cut through edge trimming is therefore implemented on the periphery of the semiconductor wafer to form a cut through straight side at the periphery and also form a flat portion at the periphery as a positioning means for taping and backside grind processes.