Taichung, Taiwan

Kuan-Hung Ho

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kuan-Hung Ho. Retrieved from https://idiyas.com/inventor/kuan-hung-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 11.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Kuan-Hung Ho: Innovator in Semiconductor Technology

Introduction

Kuan-Hung Ho is an inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on methods that enhance the performance and efficiency of semiconductor devices.

Latest Patent Applications

Kuan-Hung Ho has filed several notable patent applications. One of his latest applications is titled "LOW CONTACT RESISTANCE VIAS IN BACKEND INTERCONNECT STRUCTURES." This method involves forming a via in a dielectric layer over a substrate, followed by the creation of a second dielectric layer. The process includes selectively forming a capping layer over the via and filling the opening with an electrically conductive material. Another application is "SELECTIVE METAL CAP IN AN INTERCONNECT STRUCTURE." This method describes forming an opening in a dielectric layer to expose a metal feature, followed by the selective deposition of a metal cap and a barrier layer.

Conclusion

Kuan-Hung Ho is an innovative inventor whose work in semiconductor technology is paving the way for advancements in the field. His latest patent applications reflect his commitment to improving semiconductor device performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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