Kriangsak Sae Le

Title: Kriangsak Sae Le: Innovator in Semiconductor Packaging

Introduction

Kriangsak Sae Le is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a total of 3 patents to his name, he has made significant advancements in the methods and devices used in this critical area of technology.

Latest Patents

One of Kriangsak's latest patents focuses on semiconductor packages and methods of packaging semiconductor devices. This innovative device includes a carrier substrate with first and second major surfaces. The first surface features a die region and contact pads, while the second surface contains package contacts. The carrier substrate is designed with a patterned lead frame that defines a line level with conductive traces and a via level with via contacts. This patterned lead frame facilitates interconnections between the contact pads and package contacts. Additionally, the carrier substrate incorporates a dielectric layer that isolates the conductive traces and via contacts. A die is mounted on the die region of the first surface, showcasing Kriangsak's expertise in semiconductor technology.

Career Highlights

Kriangsak has worked with prominent companies in the semiconductor industry, including Utac Headquarters Pte. Ltd. and United Test and Assembly Center Limited. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Throughout his career, Kriangsak has collaborated with talented individuals such as Chuen Khiang Wang and Nathapong Suthiwongsunthorn. These partnerships have further enhanced his work and led to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Kriangsak Sae Le stands out as a significant figure in the realm of semiconductor innovations. His patents and career achievements reflect his dedication to advancing technology in this vital field.