Kouji Tomita

Title: Kouji Tomita: Innovator in Semiconductor Packaging

Introduction

Kouji Tomita is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His innovative designs have advanced the technology used in semiconductor devices, making them more efficient and reliable.

Latest Patents

One of Kouji Tomita's latest patents is a frame for a semiconductor package. This frame features die-pads supported by suspending leads of individual lead frames. Semiconductor devices are arranged on these die-pads, which are collectively molded with a molding compound. After molding, the semiconductor packages are cut into individual units using a dicing saw. The design includes suspending leads formed into fish tails, which help eliminate at least one of a longitudinal grid-lead and a transverse grid-lead within the areas enclosed by the fish tails. This innovative approach significantly reduces the presence of metal pieces at the edges of the semiconductor packages, regardless of the size of the R-shape generated during the etching process.

Career Highlights

Kouji Tomita is currently employed at Dai Nippon Printing Co., Ltd., where he continues to develop cutting-edge technologies in semiconductor packaging. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Throughout his career, Kouji has collaborated with notable colleagues, including Chikao Ikenaga and Tsuyoshi Tsunoda. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Kouji Tomita is a distinguished inventor whose work in semiconductor packaging has made a lasting impact on the industry. His innovative designs and collaborative efforts continue to drive advancements in technology.