The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 2004
Filed:
Aug. 31, 2001
Dainippon Printing Co., Ltd., Tokyo, JP;
Abstract
A semiconductor package is comprised of a semiconductor device mounted on a die-pad , a wire for electrically connecting some electrodes of the semiconductor device and terminals of lead frame, wires for bonding the other electrodes of semiconductor device to the surface of die-pad for grounding, and molding compound for encapsulating the outer area of semiconductor device under a state where the back face of die-pad . The lower face and side face of terminals are exposed, wherein portions plated with silver for connecting of wires on the surface of the die-pad are formed at points positioned between a peripheral edge of the die-pad and an outer edge of the semiconductor device while leaving spaces from both the edges. The adhesion of die-pad to bonding compound is improved to avoid the occurrence of wires coming-off even if heat is applied to the contact points of die-pad to wires when mounting semiconductor package on a printed circuit board.