The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 01, 2004
Filed:
May. 07, 2001
Applicant:
Inventors:
Chikao Ikenaga, Tokyo, JP;
Kouji Tomita, Tokyo, JP;
Assignee:
Dainippon Printing Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
A frame for a semiconductor package includes plural lead frames arranged through grid-leads in a matrix. Semiconductor devices are mounted on individual lead frames of the frame, and are molded with molding compound. Thereafter, the molded semiconductor devices are cut at grid-leads by means of a dicing saw so that individual semiconductor packages are obtained. The frame further has groove portions which are formed by etching the frame from the front or back at areas corresponding to grid-leads, so that the grid-leads are made thin which reduces burrs and the generation of metal powders and dust.