Company Filing History:
Years Active: 2014-2025
Title: Koudai Moroiwa: Innovator in Semiconductor Technology
Introduction
Koudai Moroiwa is a notable inventor based in Nagasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on methods and devices that enhance the production and efficiency of bonded wafers.
Latest Patents
Moroiwa's latest patents include a method for producing a support substrate for bonded wafers. This innovative process involves preparing a handle wafer body made from a monocrystalline silicon wafer, forming an oxide film on the handle wafer body, and depositing a polycrystalline silicon layer on the oxide film. Additionally, he has developed a polishing pad seasoning method, which includes a seasoning plate that abrades the polishing pad through friction caused by its rotation. This method aims to improve the performance and longevity of polishing pads used in semiconductor manufacturing.
Career Highlights
Throughout his career, Koudai Moroiwa has worked with prominent companies in the semiconductor industry, including Sumco Techxiv Corporation and Sumco Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.
Collaborations
Moroiwa has collaborated with talented individuals such as Daisuke Maruoka and Naoya Nonaka. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Koudai Moroiwa is a distinguished inventor whose work in semiconductor technology has led to valuable patents and advancements in the field. His contributions continue to influence the industry and pave the way for future innovations.