Sumco Corporation

Sumco Techxiv Corporation

Koudai Moroiwa

Naoya Nonaka

Toshiyuki Isami

Daisuke Hieda

Daisuke Maruoka

Hiroaki Ishizaki

A producing method of a handle wafer for a bonded wafer produced by bonding an active wafer and the handle wafer through an insulation film includes: preparing a handle wafer body made from a monocrystalline silicon wafer; forming an oxide film on the handle wafer body; depositing a polycrystalline silicon layer on the oxide film; forming a protective oxide film on a surface of the polycrystalline silicon layer; and polishing to remove the protective oxide film and polishing the polycrystalline silicon layer.

Method for producing support substrate for bonded wafer, and support substrate for bonded wafer

A seasoning plate is placed on a polishing pad and performs seasoning of the polishing pad by abrading the polishing pad through the friction caused by rotation of the polishing pad. The seasoning plate includes: conditioners that abrade the polishing pad; a round flexible substrate that has the conditioners attached to the lower face thereof; an O-ring that is placed on the upper face of the flexible substrate, the O-ring forming a circle concentric with the flexible substrate; and a weight plate serving as a weight portion that is placed on the O-ring and applies weight for deforming the flexible substrate.

Polishing pad seasoning method, seasoning plate, and semiconductor polishing device

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Nagasaki, Japan

Koudai Moroiwa