The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 2025
Filed:
Oct. 18, 2021
Applicant:
Sumco Corporation, Tokyo, JP;
Inventors:
Naoya Nonaka, Tokyo, JP;
Daisuke Hieda, Tokyo, JP;
Hiroaki Ishizaki, Tokyo, JP;
Toshiyuki Isami, Nagasaki, JP;
Koudai Moroiwa, Nagasaki, JP;
Assignee:
SUMCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/304 (2006.01); C23C 16/24 (2006.01); C23C 16/56 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76254 (2013.01); C23C 16/24 (2013.01); C23C 16/56 (2013.01);
Abstract
A producing method of a handle wafer for a bonded wafer produced by bonding an active wafer and the handle wafer through an insulation film includes: preparing a handle wafer body made from a monocrystalline silicon wafer; forming an oxide film on the handle wafer body; depositing a polycrystalline silicon layer on the oxide film; forming a protective oxide film on a surface of the polycrystalline silicon layer; and polishing to remove the protective oxide film and polishing the polycrystalline silicon layer.