Company Filing History:
Years Active: 2025
Title: Hiroaki Ishizaki: Innovator in Wafer Bonding Technology
Introduction
Hiroaki Ishizaki is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer bonding. His innovative methods have paved the way for advancements in the production of bonded wafers.
Latest Patents
Ishizaki holds a patent for a "Method for producing support substrate for bonded wafer, and support substrate for bonded wafer." This patent describes a comprehensive process for creating a handle wafer that is bonded to an active wafer through an insulation film. The method involves preparing a handle wafer body from a monocrystalline silicon wafer, forming an oxide film, depositing a polycrystalline silicon layer, and polishing to achieve the desired finish. He has 1 patent to his name.
Career Highlights
Hiroaki Ishizaki is currently employed at Sumco Corporation, a leading company in the semiconductor industry. His work focuses on enhancing the efficiency and quality of wafer production processes. His expertise in this field has made him a valuable asset to his organization.
Collaborations
Ishizaki has collaborated with notable colleagues, including Naoya Nonaka and Daisuke Hieda. Their combined efforts have contributed to the advancement of technologies in the semiconductor sector.
Conclusion
Hiroaki Ishizaki's innovative work in wafer bonding technology exemplifies the impact of dedicated inventors in the semiconductor industry. His contributions continue to influence advancements in this critical field.