Sumco Corporation

Hiroaki Ishizaki

Naoya Nonaka

Toshiyuki Isami

Daisuke Hieda

Koudai Moroiwa

A producing method of a handle wafer for a bonded wafer produced by bonding an active wafer and the handle wafer through an insulation film includes: preparing a handle wafer body made from a monocrystalline silicon wafer; forming an oxide film on the handle wafer body; depositing a polycrystalline silicon layer on the oxide film; forming a protective oxide film on a surface of the polycrystalline silicon layer; and polishing to remove the protective oxide film and polishing the polycrystalline silicon layer.

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Tokyo, Japan

Hiroaki Ishizaki