This inventor holds 2 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignee: Sumco Corporation. Active years: 2019-2025.
Company Filing History:
Years Active: 2019-2025
Title: Daisuke Hieda: Innovator in Semiconductor Technology
Introduction
Daisuke Hieda is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the production of bonded wafers. With a total of 2 patents, Hieda's work has advanced the methods used in the semiconductor industry.
Latest Patents
Hieda's latest patents include a method for producing a support substrate for bonded wafers. This innovative process involves preparing a handle wafer body made from a monocrystalline silicon wafer, forming an oxide film on the handle wafer body, depositing a polycrystalline silicon layer on the oxide film, and polishing to remove the protective oxide film. His second patent focuses on a disc-shaped susceptor that features a plurality of recesses aligned in a circumferential direction, designed for mounting wafers.
Career Highlights
Daisuke Hieda is currently employed at Sumco Corporation, a leading company in the semiconductor industry. His work at Sumco has allowed him to apply his innovative ideas and contribute to the development of advanced semiconductor technologies.
Collaborations
Hieda has collaborated with notable coworkers such as Hisashi Uchino and Tatsuo Kusumoto. Their combined expertise has fostered a productive environment for innovation and development within their projects.
Conclusion
Daisuke Hieda's contributions to semiconductor technology through his patents and work at Sumco Corporation highlight his role as a key innovator in the field. His advancements in bonded wafer production continue to influence the industry positively.