This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2021-2026.
Company Filing History:
Years Active: 2021-2026
Title: Kok Hou Teh: Innovator in Semiconductor Technology
Introduction
Kok Hou Teh is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving electrical performance and signal integrity in electronic devices.
Latest Patents
One of Kok Hou Teh's latest patents is titled "Vertical interconnect design for improved electrical performance." This patent describes a printed circuit board assembly that includes a circuit board with a first surface and an opposing second surface. The assembly features a first interconnect barrel with a specific design that enhances electrical performance. Another significant patent is for a "Semiconductor package having an impedance-boosting channel." This invention incorporates an impedance-boosting channel between a transmitter die and a receiver die, which improves the signal integrity of electrical signals.
Career Highlights
Kok Hou Teh is currently employed at Intel Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in developing advanced technologies that enhance the performance of electronic devices.
Collaborations
Kok Hou Teh has collaborated with several talented individuals in his field, including Bok Eng Cheah and Jackson Chung Peng Kong. These collaborations have contributed to the successful development of his patents and innovations.
Conclusion
Kok Hou Teh is a prominent inventor whose work in semiconductor technology has led to significant advancements in electrical performance and signal integrity. His contributions continue to impact the industry positively.