Kyoto, Japan

Koji Nishi

This inventor holds 25 USPTO granted patents and 1 published patent application, primarily in Thermal Printheads. Top assignees: Rohm Co., Ltd., Murata Manufacturing Co., Ltd., Screen Holdings Co., Ltd.. Active years: 1998-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koji Nishi. Retrieved from https://idiyas.com/inventor/koji-nishi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25 

% Patents Active = 80.0

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 125(Granted Patents)


Location History:

  • Yokohama, JP (1999)
  • Kyoto, JP (1998 - 2023)

Company Filing History:


Years Active: 1998-2023

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Areas of Expertise:
Thermal Printhead
Semiconductor Device
Substrate Processing
Fine Wiring Pattern
Thermal Processing
Printed Circuit Boards
Power Supply
Clip Connector
Drive IC Chip
DC-DC Converter
Multilayer Substrate
Current-Mode Control
25 patents (USPTO):Explore Patents

Title: Koji Nishi – Innovator and Patentee in Semiconductor Technology

Introduction

Koji Nishi is a distinguished inventor based in Kyoto, Japan, known for his significant contributions to semiconductor technology. With over 25 patents to his name, Nishi's innovations have played a crucial role in advancing electronic devices and systems.

Latest Patents

Among his latest patents are two groundbreaking inventions. The first, a **semiconductor device**, is designed to control the energization of a heating element used in printing. This device features a strobe signal input unit that captures a printing strobe signal, causing the heating element to generate heat. It also includes a preheating strobe generation circuit, which produces a preheating strobe signal for efficient heating management. The output controller intelligently manages energization based on both the printing and preheating strobe signals.

The second notable patent is a **substrate treating apparatus**. This apparatus performs heat treatment on substrates and consists of a heat treating plate and a casing that creates an optimal heat treatment atmosphere. Notably, the system incorporates a movable top board that adjusts its position based on substrate loading and unloading. A controller ensures that this board moves to the appropriate levels depending on the treatment process, ensuring versatile heat treatment for various substrates.

Career Highlights

Koji Nishi has made remarkable strides in his career, working with renowned companies such as Rohm Co., Ltd. and Murata Manufacturing Co., Ltd. His experiences in these organizations have undoubtedly shaped his expertise and innovation capabilities in semiconductor technology.

Collaborations

Throughout his career, Nishi has collaborated with esteemed colleagues, including Toru Momma and Takaya Nagahata. These partnerships have facilitated knowledge exchange and fostered an innovative environment leading to the development of advanced technologies.

Conclusion

In conclusion, Koji Nishi stands out as a prominent figure in the semiconductor industry. His extensive patent portfolio reflects his commitment to innovation and technological advancement. With continuous contributions to his field, Nishi remains a vital force in shaping the future of electronic technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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