The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Jan. 30, 2015
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Shinobu Obata, Kyoto, JP;
Koji Nishi, Kyoto, JP;
Takafumi Katsuno, Kyoto, JP;
Masumi Okumura, Kyoto, JP;
Nobuhito Kinoshita, Kyoto, JP;
Assignee:
Rohm Co., Ltd., Kyoto, JP;
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/05 (2006.01); B41J 2/335 (2006.01); B41J 2/045 (2006.01); H05K 3/06 (2006.01); H05K 1/09 (2006.01); H05K 3/40 (2006.01); H05K 3/12 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
B41J 2/3352 (2013.01); B41J 2/04541 (2013.01); B41J 2/3351 (2013.01); B41J 2/3353 (2013.01); B41J 2/3354 (2013.01); B41J 2/3355 (2013.01); B41J 2/3357 (2013.01); B41J 2/3359 (2013.01); B41J 2/33515 (2013.01); B41J 2/33545 (2013.01); H05K 1/09 (2013.01); H05K 1/092 (2013.01); H05K 3/06 (2013.01); H05K 3/40 (2013.01); H05K 1/0306 (2013.01); H05K 3/12 (2013.01); H05K 2201/017 (2013.01); H05K 2201/035 (2013.01); H05K 2201/0338 (2013.01);
Abstract
According to the present disclosure, a manufacturing method of a fine wiring pattern is disclosed. The manufacturing method includes preparing a support member, forming a first layer on the support member by thick-film printing, and forming a second layer including Ag on the first layer by the thick-film printing. The method also includes forming a predetermined fine wiring pattern by performing an etching process upon the first layer and the second layer.