Masumi Okumura

Title: Masumi Okumura: Fine Wiring Pattern Innovations

Introduction

Masumi Okumura is an inventor associated with Rohm Co., Ltd. in Kyoto, Japan. Her patent work focuses on fine wiring patterns and their manufacture, including applications in thermal print heads. The provided information lists 2 patents.

Latest Patents

Okumura’s listed patents describe a manufacturing approach that begins with a support member. A first layer is formed on it by thick-film printing, followed by a second layer containing silver (Ag), also formed by thick-film printing. An etching process is then used to create a predetermined fine wiring pattern from the two layers.

The patent titles are “Fine Wiring Pattern, Manufacturing Method Thereof, and Thermal Print Head” and “Fine Wiring Pattern and Composition, Manufacturing Method Thereof, and Thermal Print Head Including Fine Wiring Pattern.” Both disclosures connect fine-pattern fabrication with thermal print head technology.

Career Highlights

Okumura’s listed inventions address the formation of fine wiring through layered thick-film printing and etching. Her work is associated with Rohm Co., Ltd., a company whose patent portfolio includes electronic technologies.

Collaborations

The provided information names Takafumi Katsuno and Nobuhito Kinoshita as Okumura’s coworkers. Their inclusion reflects professional connections associated with her work.

Conclusion

Masumi Okumura’s listed patents focus on manufacturing fine wiring patterns for applications that include thermal print heads, highlighting her contributions to electronic component fabrication.