Takafumi Katsuno

Title: Takafumi Katsuno: Innovator in Fine Wiring Technology

Introduction

Takafumi Katsuno is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of fine wiring technology, holding a total of 4 patents. His innovative work has paved the way for advancements in manufacturing methods and thermal print head designs.

Latest Patents

Katsuno's latest patents include a manufacturing method for a fine wiring pattern and a thermal print head. The disclosed manufacturing method involves preparing a support member, forming a first layer on the support member through thick-film printing, and subsequently forming a second layer that includes silver (Ag) on the first layer, also via thick-film printing. The process culminates in the creation of a predetermined fine wiring pattern through an etching process applied to both the first and second layers.

Career Highlights

Katsuno is currently employed at Rohm Co., Ltd., where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and effectiveness of fine wiring applications.

Collaborations

Throughout his career, Katsuno has collaborated with notable colleagues such as Shinobu Obata and Koji Nishi. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Takafumi Katsuno's contributions to fine wiring technology and his innovative patents reflect his dedication to advancing the field. His work at Rohm Co., Ltd. and collaborations with esteemed colleagues further highlight his impact on the industry.