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For the Inventor, By the Inventor

Hyogo, Japan

Koichi Sogawa

This inventor holds 9 USPTO granted patents. Top assignee: Ricoh Company, Ltd.. Active years: 1994-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Koichi Sogawa. Retrieved from https://idiyas.com/inventor/koichi-sogawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 55.6

Average Co-Inventor Count = 1.6

ph-index = 4

Forward Citations = 52(Granted Patents)


Location History:

  • Minoo, JP (1994)
  • Kobe, JP (1994 - 2000)
  • Hyogo, JP (2003 - 2012)

Company Filing History:

goldMedal9 out of 28,940 
 
Ricoh Company, Ltd.
 patents

Years Active: 1994-2012

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9 patents (USPTO):Explore Patents
1. 8116894 - Chemical mechanical polishing method and chemical mechanical polishing device (2012-02-14),
2. 8043928 - Efficient provision of alignment marks on semiconductor wafer (2011-10-25),
3. 7755207 - Wafer, reticle, and exposure method using the wafer and reticle (2010-07-13),
4. 7692319 - Efficient provision of alignment marks on semiconductor wafer (2010-04-06),
5. 6558859 - Method of checking pattern measurement and image recognition assisting pattern (2003-05-06),
6. 6022650 - Overlay target for precise positional determination (2000-02-08),
7. 5670402 - Method of manufacturing core implanted semiconductor devices (1997-09-23),
8. 5362662 - Method for producing semiconductor memory device having a planar cell (1994-11-08),
9. 5308781 - Semiconductor memory device (1994-05-03),

Title: The Innovations of Koichi Sogawa

Introduction

Koichi Sogawa is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on improving processes and devices that enhance the efficiency and effectiveness of semiconductor manufacturing.

Latest Patents

Sogawa's latest patents include a chemical mechanical polishing method and a chemical mechanical polishing device. The chemical mechanical polishing method involves a step of forming multiple interlayer insulating films to coat various projecting patterns on substrates. This method allows for a flattening process to be performed on the interlayer insulating films before linear approximation. Additionally, he has developed a formula to calculate the polishing time required for achieving a target film thickness during the flattening process. Another notable patent is related to the efficient provision of alignment marks on semiconductor wafers. This innovation includes multi-chip areas with alignment marks that facilitate the positioning of the semiconductor wafer, optimizing the layout of device chip areas.

Career Highlights

Koichi Sogawa is currently employed at Ricoh Company, Ltd., where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the technology used in semiconductor manufacturing processes.

Collaborations

Sogawa has collaborated with notable colleagues such as Yuichi Ando and Tohru Haruki, contributing to various projects that enhance semiconductor technology.

Conclusion

Koichi Sogawa's contributions to semiconductor technology through his innovative patents and collaborations have made a significant impact in the industry. His work continues to pave the way for advancements in manufacturing processes and device efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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