This inventor holds 2 USPTO granted patents. Top assignee: Nantong Fujitsu Microelectronics Co., Ltd.. Active years: 2014-2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014-2016
Title: Innovator Spotlight: Koichi Meguro
Introduction: Koichi Meguro, an accomplished inventor based in Jiangsu, China, has made significant contributions to the field of chip packaging. With a total of two patents to his name, Meguro's innovative methods have the potential to enhance both efficiency and yield in the semiconductor manufacturing process.
Latest Patents: Meguro's latest patents revolve around advanced methods for chip packaging. The first patent outlines a novel method that includes several key steps such as providing a semi-packaged wafer with a cutting trail and a metal bonding pad. It details the formation of a sub-ball metal electrode on the bonding pad using a selective formation process, followed by the creation of a protective layer on the wafer. This design aims to prevent metal in the cutting trail from being affected during production, ensuring the protection of the discrete chip's lateral sides after cutting. This process is not only simple but also notably enhances packaging efficiency.
The second patent shares a similar methodology, emphasizing the formation of a first protective layer on the cutting trail to prevent metal separation during electroplating. By forming a solder ball on the sub-ball metal electrode and dicing along the cutting trail, this invention also simplifies the process and boosts the yield.
Career Highlights: Koichi Meguro currently works at Nantong Fujitsu Microelectronics Co., Ltd., where he applies his expertise in microelectronics to push the boundaries of chip packaging technology. His innovative ideas reflect a deep understanding of the challenges faced in semiconductor manufacturing.
Collaborations: Throughout his career, Meguro has collaborated with talented coworkers like Lei Shi and Yujuan Tao, who have contributed to the development and refinement of his groundbreaking patents. Their teamwork underscores the importance of collaboration in driving innovation within the industry.
Conclusion: Koichi Meguro stands out as a key figure in the field of chip packaging, with his patents serving as a testament to his inventive spirit and technical expertise. As the semiconductor industry continues to evolve, Meguro's contributions pave the way for more efficient and reliable chip manufacturing processes, ultimately benefitting the technology ecosystem as a whole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile