Company Filing History:
Years Active: 2012-2018
Title: Kohichi Ohsumi: Innovator in Circuit Board Technology
Introduction
Kohichi Ohsumi is a notable inventor based in Yasu, Japan, recognized for his contributions to the field of circuit board technology. With a total of four patents to his name, Ohsumi has made significant advancements in the design and manufacturing of printed circuit boards.
Latest Patents
One of Ohsumi's latest patents is a wiring board for a fingerprint sensor. This innovative wiring board features a core insulating layer with a thickness ranging from 30 µm to 100 µm, an inner buildup insulating layer between 17 µm and 35 µm, and an outer buildup insulating layer with a thickness of 7 µm to 25 µm. Additionally, it includes multiple fingerprint reading outer and inner strip-shaped electrodes, along with an upper solder resist layer that covers the outer strip-shaped electrodes with a thickness of 3 µm to 15 µm. Another significant patent is a method of manufacturing a printed circuit board. This method involves forming a through hole in an insulating layer, allowing a first plated conductor to be deposited, and subsequently etching the conductor while leaving a portion within the through hole. The process culminates in the formation of a second plated conductor that fills the outer portion of the through hole and creates a wiring conductor on both upper and lower surfaces.
Career Highlights
Ohsumi has worked with prominent companies in the technology sector, including Kyocera SLC Technologies Corporation and Kyocera Corporation. His experience in these organizations has contributed to his expertise in circuit board innovations.
Collaborations
Throughout his career, Ohsumi has collaborated with notable colleagues such as Kazunori Hayashi and Tomoharu Tsuchida. These partnerships have likely fostered a creative environment that has led to the development of his innovative patents.
Conclusion
Kohichi Ohsumi stands out as a significant figure in the realm of circuit board technology, with a focus on fingerprint sensor applications and manufacturing methods. His contributions continue to influence the industry and pave the way for future innovations.