Kyocera Slc Technologies Corporation

Kyocera Corporation

Kohichi Ohsumi

Kazunori Hayashi

Tomoharu Tsuchida

A wiring board for a fingerprint sensor includes a core insulating layer having a thickness of 30 &#x3bc;m to 100 &#x3bc;m, an inner buildup insulating layer having a thickness of 17 &#x3bc;m to 35 &#x3bc;m, an outer buildup insulating layer having a thickness of 7 &#x3bc;m to 25 &#x3bc;m, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and an upper solder resist layer covering the outer strip-shaped electrodes by a thickness of 3 &#x3bc;m to 15 &#x3bc;m.

Wiring board for fingerprint sensor

A method of manufacturing a printed circuit board includes forming a through holein an insulating layerhaving upper and lower faces so as to penetrate between the upper and lower surfaces; allowing a first plated conductorto be deposited at least in the through holeand on the upper and lower surfaces around the through hole; removing the first plated conductor overlying and underlying a periphery of the through hole by etching the first plated conductor, while leaving at least the first plated conductorin a mid-portion in a vertical direction within the through hole; and forming by semi-additive method a second plated conductorthat fills an outer portion than the first plated conductorin the through hole, and forms a wiring conductor on the upper and lower surfaces.

Method of manufacturing printed circuit board

A wiring board includes a plurality of circular semiconductor element connection pads deposited in a lattice form onto a mounting portion of an insulation substrate, their upper surfaces being connected to electrodes of a semiconductor element. A solder resist layer is deposited onto the insulation substrate, which covers the side surfaces of these pads and exposes the upper surfaces of these pads. The solder resist layer has a concave part whose bottom surface corresponds to at least all the upper surfaces of these pads.

Wiring board and manufacturing method thereof

In a wiring board, insulation layers and wiring conductors are alternately laminated, and a plurality of strip-shaped wiring conductors for connecting semiconductor elements are arranged side by side on the outermost insulation layer. Each of the wiring conductors partly has a connection pad to which the electrode terminals of the semiconductor elements are connected by flip-chip bonding. In the wiring board, a solder resist layer is deposited over the outermost insulation layer and the strip-shaped wiring conductors so as to have slit-shaped openings for exposing the upper surfaces of the connection pads. The solder resist layer fills up the space between the connection pads adjacent to each other and exposed within the slit-shaped openings.

Growing community of inventors

Yasu, Japan

Kohichi Ohsumi